PI foam is synthesized into PI aerogel by supercritical process. The product retains the excellent performance of PI foam, and the thermal conductivity is greatly reduced.
PIA is a three-dimensional cross-linked porous material composed of polymer molecular chains. Combined with the excellent performance of PI and aerogel, PIA not only has the excellent characteristics of PI, but also has the outstanding characteristics of aerogel, such as lightweight, ultra-low density, high specific surface area, low thermal conductivity, low impedance, environmental durability and low dielectric constant. These special properties make PIA materials have excellent application prospects in thermal, electrical, mechanics, acoustics and other fields.
Polyimide foam aerogel advantages
Low thermal conductivity Thermal conductivity ≤0.018
High temperature resistance, high temperature stability Long-term working temperature 300℃, thermal decomposition temperature 550℃
Hydrophobic rate is greater than 98% Long-term use, will not absorb oil smoke stains
Good weather resistance Good acid, alkali and oil resistance
VOC is 0 At 300℃, no volatile gas is released.
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